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  rev.0.01, jan.11. 2005, page 1 of 14 r1lv0416cbg-i series wide temperature range version 4m sram (256-kword 16-bit) rej03c0259-0001 preliminary rev.0.01 jan.11.2005 description the r1lv0416cbg-i is a 4-mbit static ram organized 256-kword 16-bit. the r1lv0416c-i series has realized higher density, higher performance and low power consumpti on by employing cmos process technology (6-transistor memory cell). the r1lv0416cbg-i series offers low power standby power dissipation; therefore, it is suitable for battery backup systems. it has packaged in 48-pin csp (0.75 mm ball pitch). features ? single 2.5 v and 3.0 v supply: 2.2 v to 3.6 v ? fast access time: 55/70 ns (max) ? power dissipation: ? active: 5.0 mw/mhz (typ)(v cc = 2.5 v) : 6.0 mw/mhz (typ) (v cc = 3.0 v) ? standby: 1.25 w (typ) (v cc = 2.5 v) : 1.5 w (typ) (v cc = 3.0 v) ? completely static memory. ? no clock or timing strobe required ? access and cycle times are equal. ? common data input and output. ? three state output ? battery backup operation. ? 2 chip selection for battery backup ? temperature range: ? 40 to +85 c ordering information type no. access time package r1lv0416cbg-5si 55 ns 48-ball csp with 0.75 mm ball pitch (48fhh) R1LV0416CBG-7LI 70 ns preliminary: the specifications of this device are subject to change without notice. please contact your nearest renesas technology?s sales dept. regarding specifications.
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 2 of 14 pin arrangement (top view) 48-ball csp a b c d e f g h 1 2 3 4 5 6 lb# i/o8 i/o9 v ss v cc i/o14 i/o15 nc oe# ub# i/o10 i/o11 i/o12 i/o13 nc a8 a3 a5 a17 nc a14 a0 a12 a9 a1 a4 a6 a7 a16 a15 a13 a10 a2 cs1# i/o1 i/o3 i/o4 i/o5 we# a11 cs2 i/o0 i/o2 v cc v ss i/o6 i/o7 nc pin description pin name function a0 to a17 address input i/o0 to i/o15 data input/output cs1# ( cs1 ) chip select 1 cs2 chip select 2 we# ( we ) write enable oe# ( oe ) output enable lb# ( lb ) lower byte select ub# ( ub ) upper byte select v cc power supply v ss ground nc no connection
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 3 of 14 block diagram ?           i/o0 i/o15 cs2 we# oe# a4 a3 a2 a5 a0 v v cc ss row decoder memory matrix 2,048 x 2,048 column i/o column decoder input data control control logic a6 a12 a11 a10 a9 a8 a13 a14 a15 a16 a17 a7 cs1# lb# ub# a1 lsb msb lsb msb
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 4 of 14 operation table cs1# cs2 we# oe# ub# lb# i/o0 to i/o7 i/o8 to i/o15 operation h high-z high-z standby l high-z high-z standby h h high-z high-z standby l h h l l l dout dout read l h h l h l dout high-z lower byte read l h h l l h high-z dout upper byte read l h l l l din din write l h l h l din high-z lower byte write l h l l h high-z din upper byte write l h h h high-z high-z output disable note: h: v ih , l: v il , : v ih or v il absolute maximum ratings parameter symbol value unit power supply voltage relative to v ss v cc ? 0.5 to +4.6 v terminal voltage on any pin relative to v ss v t ? 0.5 * 1 to v cc + 0.3 * 2 v power dissipation p t 0.7 w operating temperature topr ? 40 to +85 c storage temperature range tstg ? 65 to +150 c storage temperature range under bias tbias ? 40 to +85 c notes: 1. v t min: ? 3.0 v for pulse half-width 30 ns. 2. maximum voltage is +4.6 v. dc operating conditions (ta = ? 40 to +85 c) parameter symbol min typ max unit note supply voltage v cc 2.2 2.5/3.0 3.6 v v ss 0 0 0 v input high voltage v cc = 2.2 v to 2.7 v v ih 2.0 ? v cc + 0.3 v v cc = 2.7 v to 3.6 v v ih 2.2 ? v cc + 0.3 v input low voltage v cc = 2.2 v to 2.7 v v il ? 0.2 ? 0.4 v 1 v cc = 2.7 v to 3.6 v v il ? 0.3 ? 0.6 v 1 note: 1. v il min: ? 3.0 v for pulse half-width 30 ns.
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 5 of 14 dc characteristics parameter symbol min typ max unit test conditions input leakage current |i li | ? ? 1 a vin = v ss to v cc output leakage current |i lo | ? ? 1 a cs1# = v ih or cs2 = v il or oe# = v ih or we# = v il or lb# = ub# = v ih , v i/o = v ss to v cc operating current i cc ? 5 * 1 20 ma cs1# = v il , cs2 = v ih , others = v ih /v il , i i/o = 0 ma average operating current i cc1 ? 8 * 1 25 ma min. cycle, duty = 100%, i i/o = 0 ma, cs1# = v il , cs2 = v ih , others = v ih /v il i cc2 ? 2 * 1 5 ma cycle time = 1 s, duty = 100%, i i/o = 0 ma, cs1# 0.2 v, cs2 v cc ? 0.2 v v ih v cc ? 0.2 v, v il 0.2 v standby current i sb ? 0.1 * 1 0.3 ma cs2 = v il to +85 c i sb1 ? ? 10 a vin 0 v to +70 c i sb1 ? ? 8 a (1) 0 v cs2 0.2 v or to +40 c i sb1 ? 0.7 * 2 3 a (2) cs1# v cc ? 0.2 v, ? 5si to +25 c i sb1 ? 0.5 * 1 2.5 a cs2 v cc ? 0.2 v or to +85 c i sb1 ? ? 20 a (3) lb# = ub# v cc ? 0.2 v, to +70 c i sb1 ? ? 16 a cs2 v cc ? 0.2 v, to +40 c i sb1 ? 0.7 * 2 10 a cs1# 0.2 v standby current ? 7li to +25 c i sb1 ? 0.5 * 1 10 a output high voltage v cc =2.2 v to 2.7 v v oh 2.0 ? ? v i oh = ? 0.5 ma v cc =2.7 v to 3.6 v v oh 2.4 ? ? v i oh = ? 1 ma v cc =2.2 v to 3.6 v v oh2 v cc ? 0.2 ? ? v i oh = ? 100 a output low voltage v cc =2.2 v to 2.7 v v ol ? ? 0.4 v i ol = 0.5 ma v cc =2.7 v to 3.6 v v ol ? ? 0.4 v i ol = 2 ma v cc =2.2 v to 3.6 v v ol2 ? ? 0.2 v i ol = 100 a notes: 1. typical values are at v cc = 3.0 v, ta = +25 c and specified loadi ng, and not guaranteed. 2. typical values are at v cc = 3.0 v, ta = +40 c and specified loadi ng, and not guaranteed. capacitance (ta = +25 c, f = 1.0 mhz) parameter symbol min typ max unit test conditions note input capacitance cin ? ? 8 pf vin = 0 v 1 input/output capacitance c i/o ? ? 10 pf v i/o = 0 v 1 note: 1. this parameter is sampled and not 100% tested.
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 6 of 14 ac characteristics (ta = ? 40 to +85 c, v cc = 2.2 v to 3.6 v, unless otherwise noted.) test conditions ? input pulse levels: v il = 0.4 v, v ih = 2.2 v (v cc = 2.2 v to 2.7 v) : v il = 0.4 v, v ih = 2.4 v (v cc = 2.7 v to 3.6 v) ? input rise and fall time: 5 ns ? input/output timing reference levels: 1.1 v (v cc = 2.2 v to 2.7 v) : 1.4 v (v cc = 2.7 v to 3.6 v) ? output load: see figures (including scope and jig) dout 30pf r1 v tm v tm = 2.3 v r2 r1 = 3070 ? r2 = 3150 ? 50pf dout rl=500 ? 1.4 v output load (a) (v cc = 2.2 v to 2.7 v) output load (b) (v cc = 2.7 v to 3.6 v) read cycle r1lv0416cbg-i -5si -7li parameter symbol min max min max unit notes read cycle time t rc 55 ? 70 ? ns address access time t aa ? 55 ? 70 ns chip select access time t acs1 ? 55 ? 70 ns t acs2 ? 55 ? 70 ns output enable to output valid t oe ? 35 ? 40 ns output hold from address change t oh 10 ? 10 ? ns lb#, ub# access time t ba ? 55 ? 70 ns chip select to output in low-z t clz1 10 ? 10 ? ns 2, 3 t clz2 10 ? 10 ? ns 2, 3 lb#, ub# disable to low-z t blz 5 ? 5 ? ns 2, 3 output enable to output in low-z t olz 5 ? 5 ? ns 2, 3 chip deselect to output in high-z t chz1 0 20 0 25 ns 1, 2, 3 t chz2 0 20 0 25 ns 1, 2, 3 lb#, ub# disable to high-z t bhz 0 20 0 25 ns 1, 2, 3 output disable to output in high-z t ohz 0 20 0 25 ns 1, 2, 3
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 7 of 14 write cycle r1lv0416cbg-i -5si -7li parameter symbol min max min max unit notes write cycle time t wc 55 ? 70 ? ns address valid to end of write t aw 50 ? 60 ? ns chip selection to end of write t cw 50 ? 60 ? ns 5 write pulse width t wp 40 ? 50 ? ns 4 lb#, ub# valid to end of write t bw 50 ? 55 ? ns address setup time t as 0 ? 0 ? ns 6 write recovery time t wr 0 ? 0 ? ns 7 data to write time overlap t dw 25 ? 30 ? ns data hold from write time t dh 0 ? 0 ? ns output active from end of write t ow 5 ? 5 ? ns 2 output disable to output in high-z t ohz 0 20 0 25 ns 1, 2, 3 write to output in high-z t whz 0 20 0 25 ns 1, 2 notes: 1. t chz , t ohz , t whz and t bhz are defined as the time at which the outputs achieve the open circuit conditions and are not referred to output voltage levels. 2. this parameter is sampled and not 100% tested. 3. at any given temper ature and voltage condition, t hz max is less than t lz min both for a given device and from device to device. 4. a write occures during the overl ap of a low cs1#, a high cs2, a low we# and a low lb# or a low ub#. a write begins at the latest trans ition among cs1# going low, cs2 going high, we# going low and lb# going low or ub# going low. a write ends at the earliest transition among cs1# going high, cs2 going low, we# going high and lb# going high or ub# going high. t wp is measured from the beginni ng of write to the end of write. 5. t cw is measured from the later of cs1# going low or cs2 going high to the end of write. 6. t as is measured from the address va lid to the beginning of write. 7. t wr is measured from the earliest of cs1# or we# going high or cs2 going low to the end of write cycle.
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 8 of 14 timing waveform read timing waveform (we# = v ih ) t aa t acs1 t acs2 t clz2 t clz1 t blz t ba t oh t rc valid data address dout valid address high impedance cs1# cs2 lb#, ub# oe# * 1, 2, 3 * 1, 2, 3 * 2, 3 * 2, 3 * 2, 3 * 1, 2, 3 t olz * 2, 3 * 1, 2, 3 t oe t chz1 t chz2 t bhz t ohz
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 9 of 14 write timing waveform (1) (we# clock) address we# t wc t aw t wp * 4 t wr * 7 t cw * 5 t cw * 5 t bw t as * 6 t ow * 2 t whz * 1, 2 t dw t dh valid address valid data cs1# lb#, ub# dout din high impedance cs2
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 10 of 14 write timing waveform (2) (cs# clock, oe# = v ih ) address we# t wc t aw t wp * 4 t wr * 7 t cw * 5 t cw * 5 t bw t as * 6 t dw t dh valid address valid data lb#, ub# dout din high impedance cs2 cs1#
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 11 of 14 write timing waveform (3) (lb#, ub# clock, oe# = v ih ) address we# t wc t aw t wp * 4 t cw * 5 t cw * 5 t bw t wr * 7 t dw t dh valid address valid data lb#, ub# dout din high impedance cs2 cs1# t as * 6
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 12 of 14 low v cc data retention characteristics (ta = ? 40 to +85 c) parameter symbol min typ max unit test conditions * 3 v cc for data retention v dr 2.0 ? ? v vin 0v (1) 0 v cs2 0.2 v or (2) cs2 v cc ? 0.2 v, cs1# v cc ? 0.2 v or (3) lb# = ub# v cc ? 0.2 v, cs2 v cc ? 0.2 v, cs1# 0.2 v to +85 c i ccdr ? ? 10 a to +70 c i ccdr ? ? 8 a to +40 c i ccdr ? 0.7 * 2 3 a ? 5si to +25 c i ccdr ? 0.5 * 1 2.5 a to +85 c i ccdr ? ? 20 a to +70 c i ccdr ? ? 16 a to +40 c i ccdr ? 0.7 * 2 10 a data retention current ? 7li to +25 c i ccdr ? 0.5 * 1 10 a v cc = 3.0 v, vin 0v (1) 0 v cs2 0.2 v or (2) cs2 v cc ? 0.2 v, cs1# v cc ? 0.2 v or (3) lb# = ub# v cc ? 0.2 v, cs2 v cc ? 0.2 v, cs1# 0.2 v chip deselect to data retention time t cdr 0 ? ? ns see retention waveform operation recovery time t r t rc * 4 ? ? ns notes: 1. typical values are at v cc = 3.0 v, ta = +25 c and specified loadi ng, and not guaranteed. 2. typical values are at v cc = 3.0 v, ta = +40 c and specified loadi ng, and not guaranteed. 3. cs2 controls address buffer, we# buffer, cs1# buffe r, oe# buffer, lb#, ub# buffer and din buffer. if cs2 controls data retention m ode, vin levels (address, we#, oe#, cs 1#, lb#, ub#, i/o) can be in the high impedance state. if cs1# controls dat a retention mode, cs2 must be cs2 v cc ? 0.2 v or 0 v cs2 0.2 v. the other input levels (address, we#, oe#, lb#, ub#, i/o) can be in the high impedance state. 4. t rc = read cycle time.
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 13 of 14 low v cc data retention timing waveform (1) (cs1# controlled) (v cc = 2.2 v to 2.7 v) cc v 2.2 v 2.0 v 0 v cs1# t cdr t r cs1# v ? 0.2 v cc dr v data retention mode low v cc data retention timing waveform (2) (cs1# controlled) (v cc = 2.7 v to 3.6 v) cc v 2.2 v 2.7 v 0 v cs1# t cdr t r cs1# v ? 0.2 v cc dr v data retention mode low v cc data retention timing waveform (3) (cs2 controlled) (v cc = 2.2 v to 2.7 v) cc v 2.2 v 0.4 v 0 v cs2 cdr t r 0 v cs2 0.2 v dr v data retention mode t < < low v cc data retention timing waveform (4) (cs2 controlled) (v cc = 2.7 v to 3.6 v) cc v 2.7 v 0.6 v 0 v cs2 cdr t r 0 v cs2 0.2 v dr v data retention mode t < <
r1lv0416cbg-i series rev.0.01, jan.11. 2005, page 14 of 14 low v cc data retention timing waveform (5) (lb#, ub# controlled) (v cc = 2.2 v to 2.7 v) cc v 2.2 v 2.0 v 0 v lb#, ub# t cdr t r lb#, ub# v ? 0.2 v cc dr v data retention mode low v cc data retention timing waveform (6) (lb#, ub# controlled) (v cc = 2.7 v to 3.6 v) cc v 2.2 v 2.7 v 0 v lb#, ub# t cdr t r lb#, ub# v ? 0.2 v cc dr v data retention mode
revision history r1lv0416cbg-i series contents of modification rev. date page description 0.01 jan.11.2005 ? initial issue
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is al ways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating i n the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents in formation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or e rrors. please also pay attention to information published by renesas technology corp. by various means, including the renesas technolo gy corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, an d algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under cir cumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materia ls. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lice nse from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is pro hibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2730-6071 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. unit2607 ruijing building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas sales offices ? 200 4. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .2.0


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